Smart Packaging Solutions (SPS) is now offering a new security component to ePassport vendors and governments: digital passport inlays and eCovers that include a passport chip, a small antenna, and a large copper wire antenna.

The new inlays and eCovers will give manufacturers of biometric ID documents the following benefits:

  • SPS eBooster® inductive coupling technology  
  • Enhanced flexibility and reactiveness
  • Affordability and cost-efficiency
  • Reliability of the finished product.

The new ePassport product is available in two forms:

  • SPS ePassport inlays, based on a Teslin® high performance synthetic paper, guarantees durability and security. They use copper wire antennas based on SPS eBooster® inductive coupling technology to optimize reliability.
  • SPS eCovers, which combine the inlay with a passport cover. The cover, printed with the issuing country’s coat of arms, is ready for integration by ePassport manufacturers. SPS eCovers can also include additional security features, such as invisible UV inks.

“With our new inlay and eCover offer, we make ePassport manufacturers benefit from the latest innovations while keeping on building on the established advantages of SPS eBooster technology in terms of reliability and durability, making them always more flexible and competitive on ePassport markets,” said Jean-Baptiste Leos, head of products for SPS, a subsidiary of IN Groupe.

The new inlays and eCovers can accommodate any type of passport chip, with any operating system. This helps ePassport manufacturers satisfy all government requirements in terms of ICAO-compliant ePassports.

The new technology is an effort by SPS to expand its experience in producing inlays as part of biometric passports delivered to the governments of France, Peru, and many others.


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The Keesing Platform team brings you the latest in various fields, including security documents, security printing, banknotes, identity management, biometrics, blockchain, crypto technology and online onboarding.

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